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MANUFACTURING PROCESS OF INTEGRATED CIRCUITS IN FLIP-CHIP TECHNOLOGY
MANUFACTURING PROCESS OF INTEGRATED CIRCUITS IN FLIP-CHIP TECHNOLOGY
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机译:倒装芯片技术中集成电路的制造过程
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摘要
A process for manufacturing integrated circuits in flip-chip technology having contact elements (31) realised on predetermined contact areas (23), comprises the steps of readying electrical connections (30) in such a way as mutually to connect all the contact areas (23) of said integrated circuit (21), galvanically depositing a contact element (31) in correspondence with each of said contact areas (23) and interrupting said electrical connections (30) between the contact areas (23).
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