首页> 外国专利> SMALL-SIZED MODULE CAMERA, CAMERA MODULE, FABRICATING METHOD THEREFOR, IMAGING DEVICE PACKAGE, CAMERA HAVING CAMERA MODULE AND PACKAGING METHOD FOR IMAGING DEVICE

SMALL-SIZED MODULE CAMERA, CAMERA MODULE, FABRICATING METHOD THEREFOR, IMAGING DEVICE PACKAGE, CAMERA HAVING CAMERA MODULE AND PACKAGING METHOD FOR IMAGING DEVICE

机译:小型模块照相机,照相机模块,其制造方法,成像设备包装,具有照相机模块的照相机以及用于成像设备的包装方法

摘要

PURPOSE: A small-sized module camera, a camera module, a fabricating method therefor, an imaging device package, a camera having the camera module and a packaging method for an imaging device are provided to improve the efficiency of assembly work, obstruct the inflow of an under-fill material for sealing the imaging device to a substrate into a photodetecting section, and prevent the intrusion of dust into the imaging device. CONSTITUTION: An IR(Infrared) cut filter(18) is fitted to a support(16a) in an optical system housing section(19) of a ceramic substrate. A lens(11) is attached by screwing into the ceramic substrate. In an imaging device housing section(20), an imaging device(12) arranged with a photodetecting section(13) is mounted on the outer side of the support(16a) by flip-chip packaging. The neighborhood of a flip-chip packaging section is then sealed with a resin.
机译:目的:提供一种小型模块照相机,照相机模块,其制造方法,成像装置封装,具有照相机模块的照相机以及成像装置的包装方法,以提高组装效率,防止流入用于将成像装置密封至基板的底部填充材料制成光电检测部分,并防止灰尘侵入成像装置。组成:一个IR(红外)截止滤光片(18)安装在陶瓷基板光学系统外壳部分(19)的支架(16a)上。通过拧入陶瓷基板来安装透镜(11)。在成像装置容纳部(20)中,通过倒装芯片封装将设置有光检测部(13)的成像装置(12)安装在支撑体(16a)的外侧。然后用树脂密封倒装芯片封装部分的附近。

著录项

  • 公开/公告号KR20040002770A

    专利类型

  • 公开/公告日2004-01-07

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP.;

    申请/专利号KR20030042404

  • 申请日2003-06-27

  • 分类号H04N5/335;

  • 国家 KR

  • 入库时间 2022-08-21 22:50:00

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