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RADIATION-SENSITIVE RESIN COMPOSITION AND TRANSPARENT CURING RESIN PATTERN FORMED BY USING THE COMPOSITION HAVING HIGH TRANSMITTANCE TO VISIBLE LIGHT WITHOUT COLORING, SUFFICIENT SOLVENT RESISTANCE AND GOOD PROFILE
RADIATION-SENSITIVE RESIN COMPOSITION AND TRANSPARENT CURING RESIN PATTERN FORMED BY USING THE COMPOSITION HAVING HIGH TRANSMITTANCE TO VISIBLE LIGHT WITHOUT COLORING, SUFFICIENT SOLVENT RESISTANCE AND GOOD PROFILE
PURPOSE: A radiation-sensitive resin composition, a transparent curing resin pattern formed by using the composition and its preparation method are provided, to obtain a transparent pattern which has high transmittance to visible light without coloring, sufficient solvent resistance, good profile and high sensitivity to the radiation used in the formation of an insulating layer. CONSTITUTION: The radiation-sensitive resin composition comprises a copolymer containing a structural unit derived from an unsaturated carboxylic acid and a structural unit derived from an oxetanyl group-containing unsaturated compound (except an unsaturated carboxylic acid); a quinonediazide compound; and a cationic polymerization initiator comprising the salt of a tetrakis(pentafluorophenyl)borate anion and an onium cation.
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