首页> 外国专利> SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, DEVELOPMENT METHOD AND DEVELOPMENT APPARATUS TO OPTIMIZE SUBSTRATE CONVEYING SPEED

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, DEVELOPMENT METHOD AND DEVELOPMENT APPARATUS TO OPTIMIZE SUBSTRATE CONVEYING SPEED

机译:用于优化基质输送速度的基质处理方法,基质处理设备,开发方法和开发设备

摘要

PURPOSE: A substrate processing method is provided to optimize a substrate conveying speed without causing a collision accident on a convey path, and to efficiently and safely reduce a conveying speed of a substrate. CONSTITUTION: A plurality of substrates to be processed are sequentially conveyed on a convey path for desired tack time Tt so that a desired process is performed on the substrate on the convey path. The lowest transfer speed Vlow of the substrate is determined based upon the tack time, the length dimension D of the substrate in a conveying direction, and a desired minimum substrate distance d. The speed at which the substrate is transferred on the convey path is set at a speed not lower than the lowest transfer speed.
机译:目的:提供一种基板处理方法,以在不引起在输送路径上发生碰撞事故的情况下优化基板的输送速度,并有效且安全地降低基板的输送速度。组成:将多个要处理的基板顺序在传送路径上传送所需的粘着时间Tt,以便在传送路径上对基板执行所需的处理。基板的最低传送速度Vlow基于粘性时间,基板在传送方向上的长度尺寸D以及期望的最小基板距离d来确定。将基板在传送路径上传送的速度设置为不低于最低传送速度的速度。

著录项

  • 公开/公告号KR20040078578A

    专利类型

  • 公开/公告日2004-09-10

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号KR20040014275

  • 发明设计人 SADA TETSUYA;

    申请日2004-03-03

  • 分类号H01L21/68;

  • 国家 KR

  • 入库时间 2022-08-21 22:48:04

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