METHOD FOR REMOVING ORGANIC MATERIAL RESIDUES IN MANUFACTURING IMAGING SEMICONDUCTOR DEVICE TO PREVENT TROUBLE DUE TO ORGANIC MATERIAL RESIDUES IN POST PROCESS

摘要

Purpose: a kind of method is arranged to prevent the trouble due to organic substance residue, such as the polyimides of a chip pad in postpositive disposal in terms of semiconductor devices is imaged in manufacture one for removing organic substance residue by removing organic substance residue. Construction: the protective layer including an oxide layer (29) and a nitride layer, white layer (30) is formed in a wire. One filter array is on the protection layer. One planarization layer (32) includes that organic substance is formed in the color filter. One photoresist layer is formed in planarization layer. One chip pad is formed by etching planarization layer and opens wire. Photoresist layer is removed from planarization layer by using an Oxygen plasma ashing method. Photoresist residue (43) is removed from chip pad by using a stripping method.