METHOD AND APPARATUS FOR PEELING OFF PROTECTION FILM AUTOMATICALLY BY USING BONDING TAPE

摘要

PURPOSE: A method and an apparatus for removing protection film by using bonding tape are provided to peel off a protection film adhered to a PCB automatically while reducing error ratio of the PCB. CONSTITUTION: A method for removing protection film by using bonding tape comprises the steps of supplying films adhered to upper and lower sides of a PCB to an upper side of a transfer roller; transferring the PCB at front of a vacuum drum and transferring the PCB at a stopper; clamping the PCB; bonding a protection film; adsorbing a peeling part; spraying air to the peeling part; pressing the peeling part to the vacuum drum; transferring the PCB toward the front and the film adhered to the drum toward the rear; and guiding the film to a box.