ADHESIVE TAPE FOR DICING AND DIE BONDING USING ADHESIVE LAYER COMPRISING ADHESIVE COMPOSITION COMPRISING POLYIMIDE RESIN, EPOXY RESIN AND EPOXY RESIN CURING CATALYST

摘要

PURPOSE: An adhesive tape for dicing and die bonding is provided, to allow a wafer enduring dicing to be fixed by hot compression of an adhesive layer and a wafer, and a chip where an adhesive layer is adhered to be pick up easily after dicing, and to improve the adhesion stability between an adhesive layer and a die bond layer. CONSTITUTION: The adhesive tape comprises a substrate(1); a silicon adhesive layer(2) formed on the substrate; and an adhesive layer(3) formed on the silicon adhesive layer, wherein the adhesive strength of the silicon adhesive layer and the adhesive layer is 0.2-2.0 N/25 mm, and the adhesive layer comprises an adhesive composition comprising a polyimide resin, an epoxy resin and an epoxy resin curing catalyst as an essential component. Preferably the silicon adhesive layer comprises a platinum-additive curing or radiation curing silicon adhesive material; and the polyimide resin of the adhesive composition of the adhesive layer has a phenolic hydroxyl group or a siloxane structure in the frame of a polymer.