Elastomer composition using hydrogenated nitrile butadiene rubber

摘要

PURPOSE: Provided is an elastomer composition using a hydrogenated-nitrile rubber, which used as an adhesive film for semiconductor package excellent in water resistance, heat resistance and physical property, and having improved adhesion. CONSTITUTION: The elastomer composition comprises 55-75 parts by weight of solid and liquefied epoxy, 20-40 parts by weight of hydrogenated-nitrile(HNBR), and 2-10 parts by weight of hardener. The elastomer composition further comprises 5-15 phr of thermosetting agent and UV hardener with respect to the elastomer composition. The content of acrylonitrile of the hydrogenated-nitrile rubber is 15-50 parts by weight. The composition can reduce an elastic modulus of elastomer, increase water resistance and oxidation stability and thus substantially enhance a property of package, as well as improve an adhesion and physical property of the package.