Production of a flat circuit support for printed circuit boards comprises applying an electrically insulating foil on a metal layer, removing the metal layer to form a conductor structure, applying a protective layer, and further processing

摘要

Production of a flat circuit support which can be contacted on the front and rear sides comprises applying an electrically insulating foil (1) on one side of a metal layer, removing the metal layer at predetermined sites to form a conductor structure, applying a protective layer to the other side of the foil, removing the protective layer at predetermined sites, especially in the regions provided for contacting, to form a screening mask (3.1), completely removing the foil on the sites not covered by the screening mask, and removing the mask. Corroded surfaces of the conductor structure are cleaned during the course of the process, in which the cleaning is carried out with the removal of the mask in one process step.