Production of monolithic integrated semiconductor circuit comprises fixing wafer to rigid substrate after preparing component structures with front side surfaces, and further processing

摘要

Production of a monolithic integrated semiconductor circuit comprises fixing a wafer to a rigid substrate (20) after preparing component structures with front side surfaces, processing the substrate to a required thickness, forming holes (28) in the substrate and trenches (27) between the semiconductor circuits and forming a rear side metallization through the holes including the electrical connections, and removing individual semiconductor circuits from the substrate and further processing.