Semiconductor device with chip attached to heat-sink via solder layer, has collector terminal connected far from semiconductor chip so that it is not touched by solder layer

摘要

An electrical connection serving as a collector terminal (6) is attached to the semiconductor device far from the semiconductor chip (2), so that it cannot be touched by solder material from the solder layer (7) between the semiconductor chip (2) and the heat sink (1). The collector terminal comprises one part (6b) which is aligned with the surface of the heat sink, and extends at an angle down the front edge of the heat sink, before being angled upwards to become a second part.