首页> 外国专利> Assembly support for light emitting diodes, e.g. for outer and inner illumination of vehicles comprises connection pins, a flexible circuit board, and a rigid support joined by its main surfaces to the flexible circuit board

Assembly support for light emitting diodes, e.g. for outer and inner illumination of vehicles comprises connection pins, a flexible circuit board, and a rigid support joined by its main surfaces to the flexible circuit board

机译:发光二极管的组装支撑,例如用于车辆外部和内部照明的装置,包括连接销,柔性电路板以及通过其主表面连接到柔性电路板的刚性支撑

摘要

Assembly support comprises connection pins (18), a flexible circuit board, and a rigid support (12) joined by its main surfaces to the flexible circuit board. The rigid support has a bore (20) and a strip conductor section (22) for electrically connecting a light emitting diode is arranged on the composite formed by the support and circuit board. The strip conductor section is pressed into the bore on the connecting pin when the pin is extended. Independent claims are also included for the following: (1) Flexible light emitting diode module; (2) Process for assembling light emitting diodes; and (3) Process for the production of a light emitting diode module
机译:组装支撑件包括连接销(18),柔性电路板以及通过其主表面连接到柔性电路板的刚性支撑件(12)。刚性支撑件具有孔(20),在由支撑件和电路板形成的复合材料上布置有用于电连接发光二极管的带状导体部分(22)。当插针伸出时,带状导体段被压入连接插针的孔中。还包括以下方面的独立权利要求:(1)柔性发光二极管模块; (2)发光二极管的组装工艺; (3)发光二极管模块的制造方法

著录项

  • 公开/公告号DE10254662A1

    专利类型

  • 公开/公告日2004-06-09

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号DE2002154662

  • 发明设计人 HUBER RAINER;HOFMANN MARKUS;

    申请日2002-11-22

  • 分类号F21V19/00;F21S8/10;H05K7/10;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:47

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