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Production of photosensor arrangement comprises inserting first photodiode into auxiliary substrate, forming electrical connections on first side of substrate to contact photodiode, and applying support substrate
Production of photosensor arrangement comprises inserting first photodiode into auxiliary substrate, forming electrical connections on first side of substrate to contact photodiode, and applying support substrate
The production of a photosensor arrangement comprises inserting a first photodiode (103) into an auxiliary substrate, forming electrical connections on the first side of the substrate to contact the photodiode, and applying a support substrate to the first main side of the auxiliary substrate. The photodiode is structured in such a way that it can be irradiated from the second main side of the auxiliary substrate which lies opposite the first main side. An independent claim is also included for a photosensor arrangement produced by the above process.
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