Electrostatic carrier for application of a removable compound to an electrically conductive workpiece useful in semiconductor technology, e.g. in production of ultrathin wafers of thickness less than 50 microns

摘要

An electrostatic carrier for application of a removable compound to an electrically conductive workpiece (P) with a carrier substrate (5,6), a first electrode formed on the carrier substrate as an electrodense layer (4), a dielectric (2,3) formed on layer (4) giving a planar compound surface (VF), and a second electrode (1A,1B) with an E-field permeable region (l) and an E-field contact region (ll) for electrical contacting of the workpiece (P).