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Method for processing a substrate for surface treatment, e.g. rinsing, etching, polishing and cleaning, of silicon wafers comprises homogeneously selecting the speed of the process medium along the surface of the substrate
Method for processing a substrate for surface treatment, e.g. rinsing, etching, polishing and cleaning, of silicon wafers comprises homogeneously selecting the speed of the process medium along the surface of the substrate
Method for processing a substrate comprises homogeneously selecting the speed of the process medium along the surface of the substrate. An independent claim is also included for an immersion bath arrangement for processing a substrate.
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