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Cooling system for use with electronic modules has vertical plate stack for heat conduction cooled by radial flow fan
Cooling system for use with electronic modules has vertical plate stack for heat conduction cooled by radial flow fan
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机译:与电子模块一起使用的冷却系统具有垂直板叠,用于通过径流风扇进行散热的导热
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摘要
The cooling system uses a heat exchanger that consists of a stacks of cooling plates [47] with gaps in between. This locates on a frame [41] having four pillars [413]. A radial flow cooling fan [50] sits in the center of the stack and this has a radial flow impeller [55] with an electric motor [517] in the center. This blows cooling air over the plates to dissipate heat energy. The base is in contact with the heat source [39].
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