首页> 外国专利> Housing cover for closing electronic device housing has shielding plate that can be manufactured in stamping/bending process fixed to cover via journals in cover corresponding to plate openings

Housing cover for closing electronic device housing has shielding plate that can be manufactured in stamping/bending process fixed to cover via journals in cover corresponding to plate openings

机译:用于封闭电子设备外壳的外壳盖具有屏蔽板,该屏蔽板可以通过冲压/弯曲工艺制造,并通过与板开口相对应的盖中的轴颈固定在盖上

摘要

The housing cover (1) made of synthetic material includes a shielding plate (2) that can be manufactured in a stamping and bending process,and is fixed to the cover via journals in the cover that correspond to openings in the shielding plate. The housing cover at least partly has an edge, whereby the edges of the shielding plate behind the edge are angled. An independent claim is also included for the following: (a) a high frequency technical device with a housing and an inventive cover.
机译:由合成材料制成的壳体盖(1)包括可以通过冲压和弯曲工艺制造的屏蔽板(2),并且通过与该屏蔽板中的开口相对应的盖中的轴颈而固定到该盖。壳体盖至少部分地具有边缘,由此遮蔽板的在边缘之后的边缘成角度。还包括以下方面的独立权利要求:(a)具有外壳和发明性盖的高频技术设备。

著录项

  • 公开/公告号DE202004011533U1

    专利类型

  • 公开/公告日2004-09-16

    原文格式PDF

  • 申请/专利权人 HIRSCHMANN ELECTRONICS GMBH;

    申请/专利号DE20042011533U

  • 发明设计人

    申请日2004-07-22

  • 分类号H05K9/00;H05K5/02;

  • 国家 DE

  • 入库时间 2022-08-21 22:42:50

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