首页> 外国专利> Cooling system for computer housing, comprises multi-layer heat sink body provided by profiled plate with cooling ribs and cooperating plate providing flow channels for external air

Cooling system for computer housing, comprises multi-layer heat sink body provided by profiled plate with cooling ribs and cooperating plate providing flow channels for external air

机译:用于计算机壳体的冷却系统,包括多层散热器主体,该散热器主体由具有冷却肋的型材板和为外部空气提供流动通道的协作板提供

摘要

The cooling system has a multi-layer heat sink body with a heat transfer pipe (5) and a chimney effect, for dissipating waste heat generated by power electronic components. The heat sink body is provided by a Cu profiled plate (1) provided with cooling ribs (3) and a cooperating plate (2) fitted across the ribs for providing flow channels (4) for the external air.
机译:该冷却系统具有多层散热器主体,该主体具有传热管(5)和烟囱效应,用于消散由功率电子元件产生的废热。散热器主体由具有冷却肋(3)的Cu型板(1)和横跨肋安装的协作板(2)提供,该协作板(2)为外部空气提供流动通道(4)。

著录项

  • 公开/公告号DE20317869U1

    专利类型

  • 公开/公告日2004-04-01

    原文格式PDF

  • 申请/专利权人 RICHARD WOEHR GMBH;

    申请/专利号DE2003217869U

  • 发明设计人

    申请日2003-11-19

  • 分类号H05K7/20;G06F1/20;H02B1/56;

  • 国家 DE

  • 入库时间 2022-08-21 22:42:22

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