Electronic device with an E-PAC-like principle for the spatial organization of the components and the stranding

摘要

An electronic device has a chassis (60) configured to hold multiple electronic components (52, 54, 56) in a predefined three-dimensional arrangement whereby some of the electronic components are positioned elevationally above, and overlapping, other electronic components. Each electronic component has an external dimension which falls within a tolerance range between a lower acceptable tolerance limit and an upper acceptable tolerance limit. The chassis (60) has form fitting recesses (80, 84, 88) to receive and hold the electronic components. Each chassis recess is undersized relative to the lower acceptable tolerance limit for the external dimension of an associated electronic component, but the chassis has effective compliant qualities to receive and hold an electronic component even if it has an external dimension at the upper acceptable tolerance limit. The electronic components are interconnected by conductive cables. The chassis (60) has patterned cable channels (94, 96, 98, 100) formed therein to hold and guide the cables through predefined locations within the electronic device between the electronic components. IMAGE