Increasing area of useful layer of material transferred to support substrate when making composite substrate for optics by bonding substrates such that inner outline of chamfer of substrate is inscribed within outline of other substrate

摘要

Increasing the area of a useful layer of a material, particularly a semiconductor material, transferred onto a support substrate during the fabrication of a composite substrate for applications in the fields of optics, electronics or optoelectronics involves bonding front faces of source and support substrates such that an inner outline of a chamfer of one substrate is inscribed within an outline of a flat central zone of the other substrate. Increasing the area of a useful layer (63) of a material, particularly a semiconductor material, transferred onto a support substrate (7) during the fabrication of a composite substrate for applications in the fields of optics, electronics or optoelectronics involves molecular bonding a front face of a source substrate (6) to a facing front face of a support substrate, where each of the front faces has a flat central zone with a respective outline; and transferring the useful layer coming from the source substrate onto the support substrate. The useful layer extends inside the source substrate from its front face. The dimensions of the outer outline (C 61, C 71) of one of the source and support substrates are greater than the dimensions of the outer outline of the other substrate. The other substrate, i.e. the second substrate, is surrounded by a primary chamfer (64, 74) and presents a secondary chamfer (65, 75) extending between the flat central zone (60, 70) and the primary chamfer. The outer outline of the flat central zone of the first substrate presents dimensions greater than the dimensions of the inner outline of the secondary chamfer of the second substrate. During bonding, the substrates are applied one against the other in a manner such that the inner outline (C 6, C 7) of the secondary chamfer of the second substrate is inscribed within the outline of the flat central zone of the first substrate.