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Method of debugging a microprogram for development of electronic components, uses chip with integrated debugging module in conjunction with instrumentation chip which is connected during debugging

机译:调试用于开发电子元件的微程序的方法,将带有集成调试模块的芯片与在调试期间连接的仪表芯片结合使用

摘要

The microprogram development uses a chip (1) with a number of peripheral connection terminals (CP), a memory (MR) in which the microprogram under development is stored, and an integrated debugging module (ML1). An instrumentation chip (2) including a debugging module (ML2) is placed on top of the chip (1) and its terminals (SC1,SC2) connected to terminals (CI) to the main chip surface.
机译:微程序开发使用带有多个外围连接端子(CP)的芯片(1),存储正在开发的微程序的存储器(MR)和集成调试模块(ML1)。包括调试模块(ML2)的仪器芯片(2)放置在芯片(1)的顶部,其端子(SC1,SC2)连接到主芯片表面的端子(CI)。

著录项

  • 公开/公告号FR2843201A1

    专利类型

  • 公开/公告日2004-02-06

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS SA;

    申请/专利号FR20020009893

  • 发明设计人 ROGER ANDRE;

    申请日2002-08-02

  • 分类号G01R31/3183;G01R31/3187;G01R31/319;G06F11/26;G06F11/36;

  • 国家 FR

  • 入库时间 2022-08-21 22:39:28

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