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Radio frequency module for communication module, has dielectric substrate whose thickness and nature are selected by holding account of surface of conductive layer and stock points, to couple another layer to earth by capacitor
Radio frequency module for communication module, has dielectric substrate whose thickness and nature are selected by holding account of surface of conductive layer and stock points, to couple another layer to earth by capacitor
The module has a dielectric substrates (6) bearing conducting aerial layer and a substrate (8) bearing circuit units (30) e.g. inductance, capacitor, and a conductive shield layer (10). Thickness and nature of the substrate are selected by holding account of surface of a conductive layer and stock points, so that the layer (10) is coupled to the earth by a capacitor constituting a short-circuit for the radio frequencies. The conductive shield layer (10) being floating is laid out between the dielectric substrates.
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