首页> 外国专利> Radio frequency module for communication module, has dielectric substrate whose thickness and nature are selected by holding account of surface of conductive layer and stock points, to couple another layer to earth by capacitor

Radio frequency module for communication module, has dielectric substrate whose thickness and nature are selected by holding account of surface of conductive layer and stock points, to couple another layer to earth by capacitor

机译:用于通信模块的射频模块,具有介电基片,其厚度和性质通过考虑导电层的表面和基点来选择,以通过电容器将另一层接地

摘要

The module has a dielectric substrates (6) bearing conducting aerial layer and a substrate (8) bearing circuit units (30) e.g. inductance, capacitor, and a conductive shield layer (10). Thickness and nature of the substrate are selected by holding account of surface of a conductive layer and stock points, so that the layer (10) is coupled to the earth by a capacitor constituting a short-circuit for the radio frequencies. The conductive shield layer (10) being floating is laid out between the dielectric substrates.
机译:该模块具有承载导电层的介电基板(6)和承载电路单元(30)(例如,绝缘层)的基板(8)。电感,电容器和导电屏蔽层(10)。通过考虑导电层的表面和堆焊点来选择衬底的厚度和性质,使得层(10)通过电容器构成接地,该电容器构成了射频的短路。浮置的导电屏蔽层(10)布置在电介质基板之间。

著录项

  • 公开/公告号FR2847726A1

    专利类型

  • 公开/公告日2004-05-28

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS SA;

    申请/专利号FR20020014905

  • 发明设计人 KNOPIK VINCENT;BELOT DIDIER;

    申请日2002-11-27

  • 分类号H01Q9/04;

  • 国家 FR

  • 入库时间 2022-08-21 22:39:21

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