首页> 外国专利> Application of Nano Imprint Lithography for use in micro-technology involves pressing substrates in a mould provided with a motif of hollows and projections through to a hardened polymer sub-layer

Application of Nano Imprint Lithography for use in micro-technology involves pressing substrates in a mould provided with a motif of hollows and projections through to a hardened polymer sub-layer

机译:纳米压印平版印刷技术在微技术中的应用包括将模具中的基材压入具有凹陷和凸起图案的模具中,直至到达硬化的聚合物子层

摘要

Lithography by pressing a substrate includes a preparation stage during which the substrate (1) is covered with a layer, a pressing stage in a mould provided with a motif made up of hollows and projections on only a part of the thickness of the layer, at least one stage of attack on the layer to denude some parts of the substrate surface and a stage of engraving the substrate with the mould motif. The preparation stage includes a sub-stage for the formation of a lower sub-layer (2A) of a hardenable material, a stage of hardening this sub-layer and a sub-stage for the formation of an outer sub-layer adjacent to the hardened sub-layer. The pressing stage includes the penetration of the projections of the mould into this outer sub-layer up to contact with the hardened sub-layer.
机译:通过对基板进行压制而进行的光刻包括:准备阶段,在该阶段中,基板(1)被覆盖一层;在模具中的压制阶段,在模具上设置有仅由层的厚度的一部分上的凹陷和凸起构成的图案。对层的侵蚀至少一个阶段以剥落基板表面的某些部分,以及在基板上雕刻模具图案的阶段。准备阶段包括用于形成可硬化材料的下部子层(2A)的子阶段,用于硬化该子层的阶段以及用于形成与该子层相邻的外部子层的子阶段。硬化子层。压制阶段包括使模具的突出部渗透到该外部子层中,直至与硬化的子层接触。

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