UNLEADED SOLDER, SOLDERING METHOD AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide unleaded solder having excellent thermal conductivity, wettability and mechanical strength and a soldering method to provide electronic components which are joined by the unleaded solder and have high reliability.;SOLUTION: The surface tension of Sn or an Sn-based alloy can be lowered and the wettability can be improved by the unleaded solder composed of an Sn-based alloy containing 0.02 to 2.0 wt% Co and not containing Sn or Pb. Further, the aggregation of the molten solder can be suppressed and the wettability can be improved by suppressing reaction of a member to be soldered with the Sn or the Sn-based alloy and suppressing the growth of an intermetallic compound at a joint boundary.;COPYRIGHT: (C)2006,JPO&NCIPI