FORMATION METHOD FOR GROUND LAYER IN MOLDED ELECTRICAL APPARATUS AND SHEATH-GROUNDED MOLDED ELECTRICAL APPARATUS

摘要

PROBLEM TO BE SOLVED: To easily form the ground layer of a sheath-grounded molded electrical apparatus in a short time.;SOLUTION: A formation method for the ground layer of a sheath-grounded molded electrical apparatus comprises: a step in which silicone mold releasing agent is applied to a metal mold, and insulating material is molded with the metal mold with a main circuit end exposed to prepare an electrical apparatus with an insulating layer 2 formed thereon; a step in which paintable silicone compatible with the silicone mold releasing agent is applied to the outer face of the insulating layer 2; and a step in which epoxy-resin electrical conductive coating is applied to the outer face of the insulating layer 2 to form a ground layer 5. After the application of the paintable silicone, the epoxy-resin electrical conductive coating is applied with this state maintained.;COPYRIGHT: (C)2005,JPO&NCIPI