THERMAL ANALYSIS METHOD AND EQUIPMENT IN REFLOW COMPONENT MOUNTING, AND REFLOW EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a thermal analysis method capable of rationalizing the conditions of a heating means for melting a bonding material and the conditions of a cooling means for removing thermal energy being transmitted from the heating means to a low heat resistance component efficiently with high accuracy at the time of reflow mounting of the low heat resistance component on a substrate.;SOLUTION: Component mounting data, component characteristics data and material data are combined to create a substrate model. At least two combinations are selected from a plurality of heating means and cooling means having different characteristics to create a plurality of process basic models. Subsequently, a plurality of substrate analysis models are created from the substrate model and respective process basic models, and thermal analysis processing is carried out simultaneously for respective substrate analysis models by experimental planning method thus rationalizing the heating means and the cooling means.;COPYRIGHT: (C)2005,JPO&NCIPI