THERMALLY CONDUCTIVE COMPOSITION, AND PUTTY-LIKE HEAT RADIATING SHEET AND HEAT RADIATING STRUCTURE USING THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide a thermally conductive composition, which can be easily detached from a releasing mounting (2) with hand and can be transferred to a heat radiating part or to a heat radiator from a releasing sheet and can be attached simply on an objective place, and also to provide a putty-like heat radiating sheet using the composition. PSOLUTION: The thermally conductive composition comprises 100 pts.wt. of liquid silicone with viscosity in the range of 20-2,000 mPas and 600 pts.wt. or more of a thermally conductive filler, wherein cross-linking does not proceed at the normal temperature of 25C and the composition stays putty-like consistency and uncured and has heat conductivity of at least 3 W/m K. The putty-like heat radiating sheet is prepared by molding the above heat conductive composition on a releasing sheet and has a thickness of 0.5-3 mm. The heat radiating structure is prepared by placing the above putty-like heat radiating sheet between a heat radiating element and a heat radiating material (4). PCOPYRIGHT: (C)2005,JPO&NCIPI