IC CARD, IC MODULE, INLET FOR NON-CONTACT IC CARD, METHOD FOR MANUFACTURING IC MODULE AND METHOD FOR MANUFACTURING INLET FOR NON-CONTACT IC CARD

摘要

PPROBLEM TO BE SOLVED: To inexpensively and easily uniformize intensity such as dot pressure intensity, to reduce the generation of air bubbles in adhesive, and to realize the stabilization and strengthening of dot pressure intensity, impact resistivity and the improvement of durability. PSOLUTION: This IC card incorporates at least an IC chip in its inside, the IC chip is provided with a reinforcing board through adhesive, and the adhesive consists of two or more types of adhesives whose elastic modulus is different. The two or more types of adhesives are arranged so that adhesives whose elastic modulus is higher is arranged at the central part of the IC chip or the reinforcing board and adhesives whose elastic modulus is lower than that of the adhesive at the central part is arranged at the circumferential part. Also, the two or more types of adhesives are arranged like a pattern. PCOPYRIGHT: (C)2005,JPO&NCIPI