MECHANOCHEMICAL POLISHING METHOD AND MECHANOCHEMICAL POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a mechanochemical polishing method and a mechanochemical polishing method with reduced environmental load by suppressing the rise of the temperature of a work without obstructing the induction of a chemical reaction in mechanochemical polishing to increase polishing efficiency and reduce cost.;SOLUTION: An atomized water W1 in the state of a grinding wheel T not pressed against the surface of a wafer H suckingly placed on a turn table D through a chuck C and rotated is sprayed from a cooling liquid supply nozzle 2 without spraying on the grinding wheel T to cool the wafer H in a wet state. In this state, the mechanochemical polishing is started and, after the wafer H is brought into a water-repellant state, the atomized water W1 sprayed from the cooling liquid supply nozzle 2 is switched to a liquid water W2 to cool the wafer H while supplying the liquid water W2 to the surface of the wafer H without spraying the water on the grinding wheel T for the mechanochemical polishing.;COPYRIGHT: (C)2005,JPO&NCIPI