首页> 外国专利> PROBE NEEDLE POLISHING DEVICE AND PROBE NEEDLE POLISHING METHOD

PROBE NEEDLE POLISHING DEVICE AND PROBE NEEDLE POLISHING METHOD

机译:探针针抛光装置及探针针抛光方法

摘要

PROBLEM TO BE SOLVED: To provide a probe needle polishing device eliminating complicated selection work of a polishing member and shortening time for polishing work.;SOLUTION: This probe needle polishing device has three or more polishing members 4, 10; an information input means 36 for inputting identification information on a probe needle 16 when mounting the probe needle 16; a storage means 38 storing the corresponding relation of the probe needle 16 and polishing members 4, 10 in relation to the mutual identification information; and a selection control means for selecting the corresponding polishing members 4, 10 referring to the storage means 38 based on the identification information inputted by the information input means 36 when polishing the probe needle 16, and controlling moving means 5, 6, 11, 9, 23, 32 so that the probe needle 16 comes in contact with the selected polishing members 4, 10.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种探针抛光装置,其消除了抛光构件的复杂选择工作并缩短了抛光工作的时间。解决方案:该探针抛光装置具有三个或更多个抛光构件4、10;和信息输入装置36,用于在安装探针16时在探针16上输入识别信息。存储装置38存储与相互识别信息有关的探针16和抛光构件4、10的对应关系。以及选择控制装置,用于在抛光探针16时根据信息输入装置36输入的识别信息,参照存储装置38选择相应的抛光构件4、10,并控制移动装置5、6、11、9 ,23、32,以便探针16与选定的抛光元件4、10接触。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005177892A

    专利类型

  • 公开/公告日2005-07-07

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20030419435

  • 发明设计人 TODA HISANAO;

    申请日2003-12-17

  • 分类号B24B51/00;B24B19/16;

  • 国家 JP

  • 入库时间 2022-08-21 22:31:24

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