PHOTOSENSITIVE POLYAMIDE ACID COMPOSITION, PATTERNIZED POLYIMIDE RESIN FILM OBTAINED FROM THE SAME AND UTILIZATION OF THOSE FOR CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a new photosensitive polyamide acid composition giving a polyimide resin film having a low dielectric constant as well as excellent properties peculiar to a polyimide resin, and to provide such a low dielectric constant polyimide resin film.;SOLUTION: The photosensitive polyamide acid composition contains a polyamide acid comprising a repeating unit represented by formula (I) (where R denotes a divalent organic group) and a certain dihydropyridine derivative (such as nifedipine) as a photosensitive agent. Such a photosensitive polyamide acid composition gives a polyimide resin film having a low dielectric constant of 2.5-3.0 when formed into a film, irradiated with UV, patternized and heated.;COPYRIGHT: (C)2005,JPO&NCIPI