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FILM FORMATION METHOD USING CHARGED PARTICLE BEAM, SELECTIVE ETCHING METHOD, AND CHARGED PARTICLE BEAM DEVICE

机译:使用带电粒子束的成膜方法,选择性刻蚀方法和带电粒子束装置

摘要

PROBLEM TO BE SOLVED: To provide a charged particle beam device capable of forming a film in an intended scanning area more effectively than before, with a film formation technology of scanning a converged charged particle beam, and capable of applying a selective etching on an intended scanning area more effectively than before, with a selective etching technology of scanning a converged charged particle beam.;SOLUTION: A setting of an optical system as an optimum way of scanning charged particle beam, a beam staying period, and a scanning distance are found against an intended irradiation area for film formation and selective etching, depending on a deposition rate stored in advance or a scanning cycle dependent etching rate, and the result of judgment is displayed.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种带电粒子束装置,其能够比以前更有效地在预定的扫描区域中形成膜,并且具有扫描会聚的带电粒子束的成膜技术,并且能够对预定的目标进行选择性蚀刻。通过使用选择性蚀刻技术扫描会聚的带电粒子束,可以比以前更有效地扫描区域;解决方案:找到了光学系统的设置,作为扫描带电粒子束的最佳方式,光束停留时间和扫描距离取决于预先存储的沉积速率或扫描周期相关的蚀刻速率,以判断成膜和选择性蚀刻的目标照射区域,并显示判断结果。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005108472A

    专利类型

  • 公开/公告日2005-04-21

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;HITACHI HIGH-TECHNOLOGIES CORP;

    申请/专利号JP20030336691

  • 发明设计人 FUKUDA MUNEYUKI;SHICHI HIROYASU;

    申请日2003-09-29

  • 分类号H01J37/30;C23C14/32;H01J37/305;H01J37/317;H01L21/302;

  • 国家 JP

  • 入库时间 2022-08-21 22:30:42

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