SEMICONDUCTOR PACKAGE HAVING CUTTING GROOVE ON SIDE FLASH, METHOD OF FORMING THIS CUTTING GROOVE, DEFLASHING METHOD IN SEMICONDUCTOR PACKAGE HAVING CUTTING GROOVE

摘要

PPROBLEM TO BE SOLVED: To provide a deflash technique for removing flash from a portion to be plated before a plating process and after a sealing process by resin molding in a process of manufacturing a semiconductor package, and to provide a technique for removing side flash formed on a side of a lead frame where the deflash processing is difficult to be performed. PSOLUTION: Deflashing efficiency and product quality can be improved by providing a semiconductor package in which a cutting groove 20 is formed to a lead portion 14 by an irradiation medium of laser beam etc. on one part of a side flash 30 of the lead frame where it is conventionally difficult to completely remove flash even by deflsashing method by ultra-high pressure water jet or media etc. and it is difficult to apply a deflashing technique by moving irradiation of a laser beam, and by providing a method of forming the cutting groove, and a deflashing method in the semiconductor package having the cutting groove. PCOPYRIGHT: (C)2005,JPO&NCIPI