The vector modulator where the orthogonal hybrid and inside is improved the tip/chip scale package which uses that are improved

摘要

SolutionsThe 1st helical inductor the orthogonal hybrid circuit which consists of 301 which is separated in order to give all necessary specific capacitance according to this invention, until recently with technology without using the individual capacitor which is necessary, by insulating layer 317 and 2nd helical inductor 303 is offered. Furthermore, the monolithic microwave integrated circuit which is included inside the tip/chip scale package (the vector modulator circuit which installs the plural orthogonal hybrid circuits in MMIC) top is offered.