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Heat pipe heat sink, integrated circuit package and central processing unit using the same

机译:热管散热器,使用该散热器的集成电路封装和中央处理器

摘要

PROBLEM TO BE SOLVED: To provide a heat sink with a heat pipe making feasible the facilitation of manufacture and cost reduction. SOLUTION: A heat sink is composed of a base 5 fitted to a heating element 3 by screws 2, an upper plate 7 fixed to the upper end of the base 5, four each of heat radiation fins 9 laminated and fixed to the upperside of the upper plate 7 and a header 11 fixed on the upper parts of the heat radiation fins 9. The heat radiation fins 9 are press-formed products of brazed sheet made of relatively thin aluminum alloy sheet and four heat pipes 31 are protruded on the positions corresponding to the working fluid communication holes 27. On the other hand, the heat pipes 31 take tapered pipe shape with their diameters tapering from the base ends to the front ends so as to be formed in the inner diameter on the front ends almost equal to that of the working fluid communication holes 27.
机译:要解决的问题:提供一种带有热管的散热器,以简化制造过程并降低成本。解决方案:散热器由通过螺钉2固定在加热元件3上的基座5,固定在基座5上端的上板7,四个层​​叠并固定在散热器5上侧的散热片9组成上板7和固定在散热片9的上部的集管11。散热片9是由较薄的铝合金板制成的钎焊板的压制成型品,并且在对应的位置突出有四个热管31。另一方面,热管31呈锥形管形状,其直径从基端到前端逐渐变细,从而形成在前端的内径几乎等于其内径。工作流体连通孔27中的一个。

著录项

  • 公开/公告号JP3645674B2

    专利类型

  • 公开/公告日2005-05-11

    原文格式PDF

  • 申请/专利权人 昭和電工株式会社;

    申请/专利号JP19960315415

  • 发明设计人 太田 圭一郎;

    申请日1996-11-12

  • 分类号H01L23/427;

  • 国家 JP

  • 入库时间 2022-08-21 22:29:11

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