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Heat pipe heat sink, integrated circuit package and central processing unit using the same
Heat pipe heat sink, integrated circuit package and central processing unit using the same
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机译:热管散热器,使用该散热器的集成电路封装和中央处理器
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摘要
PROBLEM TO BE SOLVED: To provide a heat sink with a heat pipe making feasible the facilitation of manufacture and cost reduction. SOLUTION: A heat sink is composed of a base 5 fitted to a heating element 3 by screws 2, an upper plate 7 fixed to the upper end of the base 5, four each of heat radiation fins 9 laminated and fixed to the upperside of the upper plate 7 and a header 11 fixed on the upper parts of the heat radiation fins 9. The heat radiation fins 9 are press-formed products of brazed sheet made of relatively thin aluminum alloy sheet and four heat pipes 31 are protruded on the positions corresponding to the working fluid communication holes 27. On the other hand, the heat pipes 31 take tapered pipe shape with their diameters tapering from the base ends to the front ends so as to be formed in the inner diameter on the front ends almost equal to that of the working fluid communication holes 27.
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