首页> 外国专利> HEAT-BONDING SHEET FOR THERMALLY PEELABLE ADHESIVE SHEET SEAM AND METHOD FOR CONNECTING THERMALLY PEELABLE ADHESIVE SHEET

HEAT-BONDING SHEET FOR THERMALLY PEELABLE ADHESIVE SHEET SEAM AND METHOD FOR CONNECTING THERMALLY PEELABLE ADHESIVE SHEET

机译:用于可热剥离的胶粘剂板的热粘合片和用于连接可热剥离的胶粘剂板的方法

摘要

PROBLEM TO BE SOLVED: To provide a method for connecting a thermally peelable adhesive sheet, by which sufficient bond strength is secured even if the thermally peelable adhesive sheet is foamed or expanded after connected at the sheet edge.;SOLUTION: The method for connecting a thermally peelable adhesive sheet is a method for connecting a thermally peelable adhesive sheet equipped with a thermally expandable adhesive layer containing a thermally expandable microsphere on at least one side of a substrate by using an adhesive sheet at the sheet edge and comprises connecting the thermally peelable adhesive sheet by using an adhesive sheet for a thermally peelable adhesive sheet seam. Preferably the thermally peelable adhesive sheet is connected by thermally bonding a thermally bondable sheet for the thermally peelable adhesive sheet seam to both sides of surfaces of a part including the seam of a sheet end part of the thermally peelable adhesive sheet to be connected.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种连接可热剥离粘合片的方法,即使在该热可剥离粘合片在片材边缘连接后发泡或膨胀,也可确保足够的粘合强度。可热剥离粘合片是通过在片材边缘使用粘合片来连接在基板的至少一侧上配备有包含可热粘合层的可热粘合层的可热粘合片的方法,并且包括连接可热剥离粘合剂。通过将粘合片用于可热剥离的粘合片接缝来形成片材。优选地,通过将​​用于可热剥离粘合片接缝的可热粘合片热粘合到包括要连接的可热剥离粘合片的片端部的接缝在内的部分的表面的两侧来连接可热剥离粘合片。 :(C)2005,日本特许厅

著录项

  • 公开/公告号JP2005060488A

    专利类型

  • 公开/公告日2005-03-10

    原文格式PDF

  • 申请/专利权人 NITTO DENKO CORP;

    申请/专利号JP20030291019

  • 发明设计人 DOI TOMOKO;MURATA AKIHISA;ARIMITSU YUKIO;

    申请日2003-08-11

  • 分类号C09J7/00;C09J5/00;C09J7/02;C09J201/00;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 22:28:54

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