METHOD OF APPLYING NICKEL PLATING TO ELECTROCONDUCTIVE FILM ON METALLIC OXIDE COMPACTED SINTERED MATTER AND NICKEL PLATING LIQUID COMPOSITION FOR ELECTRICALLY CONDUCTIVE FILM

摘要

PROBLEM TO BE SOLVED: To apply nickel plating to an electroconductive film on a metallic oxide compacted sintered matter without depending on shielding treatment.;SOLUTION: When nickel plating is applied to an electroconductive film on the metallic oxide compacted sintered matter, the concentration of a nickel salt selected as the essential component of a plating liquid is held to 70 to 200 g/L, the pH of the plating liquid to 5.4 to 6.6, and the temperature of the plating liquid to 60°C±5°C, and within 2 hr, the element assembly of the metal oxide compacted fired matter is subjected to direct plating at a conducting current of 3 to 5 A.;COPYRIGHT: (C)2005,JPO&NCIPI