Particle pollution control manner and particle pollution control structure

摘要

PPROBLEM TO BE SOLVED: To provide a method and a structure for preventing the contamination caused by particles when a substrate such as a semiconductor wafer is stored or transported. PSOLUTION: A laminar flow boundary layer or a turbulent flow boundary layer is formed over the whole area on the surface of the semiconductor wafer W by making clean air flow along the surface of the wafer W arranged horizontally in the environment 38 having a prescribed cleanliness at a prescribed speed relative to the surface of the wafer W. The fluid in the laminar flow boundary layer or the turbulent flow boundary layer formed on the surface of the wafer W is regarded as a viscous fluid with respect to minute particles. Accordingly, even if the particles float in the environment where the wafer W is arranged and descend toward the wafer W, the descent of the particles is hindered by the layer of the viscous fluid so that the contamination caused by the particles can be prevented. PCOPYRIGHT: (C)2003,JPO