Epoxy resin blend, epoxy resin constituent and its hardened material

摘要

PROBLEM TO BE SOLVED: To obtain a light epoxy resin mixture expressing a low melt viscosity, excellent in heat resistance, low water absorption, adhesiveness and workability and useful for insulation media for electric and electronic parts, adhesives, coatings, etc., by mixing a specific epoxy resin, etc. ;SOLUTION: The epoxy resin mixture is obtained by mixing (A) an epoxy resin expressed by formula I [(n) is 1-10 in average; t-Bu is tertiary butyl; Me is methyl; G is glycidyl] with preferably 20-80wt.% of (B) an epoxy resin expressed by formula II [(n) is 0-10 in average]. This epoxy resin composition is obtained by blending 100 pts.wt of the epoxy resin mixture with 0.01-15 pts.wt. of a curing agent such as 2-methylimidazole and 0-90 pts.wt. of an inorganic filler such as silica.;COPYRIGHT: (C)1998,JPO