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The tin or tin alloy electroplate bath which possesses tin or tin alloy electroplate

机译:具有锡或锡合金电镀液的锡或锡合金电镀液

摘要

PROBLEM TO BE SOLVED: To prevent the erosion of electronic parts by a plating liquid and to avert the deposition of metal on an insulator part even if a current density is increased by using a plating bath which contains a tin (II) salt, or metal salt contg. the same, a complexing salt and a brightening agent consisting of an amine or amide compd. and has pH in a specific range. ;SOLUTION: The plating bath contains the tin (II) salt or the tin (II) salt and at least one kind of the metal salts selected from lead, copper, zinc, cobalt and nickel. The complexing salt is adequately citric acid, etc. The polyoxyethylene alkylamine or polyoxyethylene alkylamide expressed by either of formula I or formula II is used as the brightening agent. In the formulas, R is 6 to 8C alkyl group, m+n is an integer from 2 to 11. The amt. of the brightening agent to be added is wide in its effective range as the brightening agent is hardly decomposed by reduction but if the agent is added too much to the bath, air foamability increases. The amt. is, therefore, specified preferably to 0.5 to 5 g/l. The pH of the plating bath is specified to a range of 3 to 10.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:即使使用含有锡(II)盐或金属的镀液增加了电流密度,也可以防止电镀液腐蚀电子部件并避免金属在绝缘体部件上的沉积盐续同样,由胺或酰胺组成的络合盐和增白剂组成。 pH值在特定范围内。 ;解决方案:电镀液包含锡(II)盐或锡(II)盐以及至少一种选自铅,铜,锌,钴和镍的金属盐。络合盐是足够的柠檬酸等。由式I或式II表示的聚氧乙烯烷基胺或聚氧乙烯烷基酰胺用作增白剂。式中,R为6〜8C的烷基,m + n为2〜11的整数。增白剂的添加量在有效范围内较宽,这是因为增白剂几乎不能通过还原而分解,但是如果将过量的增白剂添加到浴中,则空气起泡性增加。 AMT。因此,优选将其规定为0.5至5g / l。电镀液的pH值规定为3到10。COPYRIGHT:(C)1998,JPO

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