首页> 外国专利> Process for the metallization and/or brazing with a silicon alloy of parts made of an oxide ceramic unable to be wetted by the said alloy

Process for the metallization and/or brazing with a silicon alloy of parts made of an oxide ceramic unable to be wetted by the said alloy

机译:用硅合金对不能被所述合金润湿的氧化物陶瓷制成的零件进行金属化和/或钎焊的方法

摘要

The invention relates to a process for the metallization with a silicon alloy melting at a temperature T1 of certain zones of the surface of a part made of an oxide ceramic unable to be wetted by the said alloy, the said process comprising, in succession, a step of depositing carbon on the said zones of the said part that are to be metallized, a step of depositing the silicon alloy in solid form on at least one portion of the said part, so that the said alloy has at least one point of contact with the said zones to be metallized, followed by a heating step at a temperature greater than or equal to T1, the said alloy gathering in the molten state on the said zones to be metallized. This process applies also to the brazing of parts, at least one of which is a part made of an oxide ceramic unable to be wetted by the said alloy. Application of the said processes to the fields of electronics, electrical engineering, thermal engineering and chemical engineering.
机译:本发明涉及一种用硅合金进行金属化的方法,该合金在不能被所述合金润湿的氧化物陶瓷制成的零件的表面的某些区域的温度T1下熔化,所述方法依次包括:在所述零件的待金属化的所述区域上沉积碳的步骤,在所述零件的至少一部分上以固态形式沉积硅合金的步骤,以使所述合金具有至少一个接触点在将要金属化的所述区域中,随后在大于或等于T1的温度下进行加热步骤,所述合金以熔融态聚集在所述要金属化的区域上。该方法也适用于零件的钎焊,其中至少一个是由氧化物陶瓷制成的零件,该零件不能被所述合金润湿。所述方法在电子,电气工程,热工程和化学工程领域中的应用。

著录项

  • 公开/公告号US2005127146A1

    专利类型

  • 公开/公告日2005-06-16

    原文格式PDF

  • 申请/专利权人 VALERIE CHAUMAT;CAROLE PAGANO;

    申请/专利号US20030451703

  • 发明设计人 VALERIE CHAUMAT;CAROLE PAGANO;

    申请日2002-10-24

  • 分类号B23K31/00;

  • 国家 US

  • 入库时间 2022-08-21 22:26:09

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号