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Chip mounting substrate, first level assembly, and second level assembly
Chip mounting substrate, first level assembly, and second level assembly
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机译:芯片安装基板,第一级组件和第二级组件
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摘要
A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.
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