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Solid state device with encapsulant of cycloaliphatic epoxy resin, anhydride, and boron catalyst
Solid state device with encapsulant of cycloaliphatic epoxy resin, anhydride, and boron catalyst
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机译:具有脂环族环氧树脂,酸酐和硼催化剂的密封剂的固态装置
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摘要
Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
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