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Reprogrammable non-volatile memory using a breakdown phenomena in an ultra-thin dielectric

机译:利用超薄电介质中的击穿现象的可重编程非易失性存储器

摘要

A reprogrammable non-volatile memory array and constituent memory cells is disclosed. The semiconductor memory cells each have a data storage element constructed around an ultra-thin dielectric, such as a gate oxide. The gate oxide is used to store information by stressing the ultra-thin dielectric into breakdown (soft or hard breakdown) to set the leakage current level of the memory cell. The memory cell is read by sensing the current drawn by the cell. A suitable ultra-thin dielectric is high quality gate oxide of about 50 Å thickness or less, as commonly available from presently available advanced CMOS logic processes. The memory cells are first programmed by stressing the gate oxide until soft breakdown occurs. The memory cells are then subsequently reprogrammed by increasing the breakdown of the gate oxide.
机译:公开了一种可重新编程的非易失性存储器阵列和组成存储器单元。半导体存储单元均具有围绕诸如栅极氧化物的超薄电介质构造的数据存储元件。栅极氧化物用于通过将超薄电介质施加应力击穿(软击穿或硬击穿)以设置存储单元的泄漏电流水平来存储信息。通过感测存储单元汲取的电流来读取存储单元。合适的超薄电介质是厚度约为50埃或更小的高质量栅氧化层,通常可从当前可用的高级CMOS逻辑工艺中获得。首先通过对栅极氧化物施加应力直到发生软击穿来对存储单元进行编程。然后通过增加栅极氧化物的击穿来对存储单元进行重新编程。

著录项

  • 公开/公告号US6956258B2

    专利类型

  • 公开/公告日2005-10-18

    原文格式PDF

  • 申请/专利权人 JACK ZEZHONG PENG;

    申请/专利号US20020264212

  • 发明设计人 JACK ZEZHONG PENG;

    申请日2002-10-03

  • 分类号H01L27/108;

  • 国家 US

  • 入库时间 2022-08-21 22:20:56

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