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Method for toolmatching and troubleshooting a plasma processing system

机译:等离子处理系统的工具匹配和故障排除方法

摘要

A method tests a plasma processing system having a chamber, an RF power source, and a matching network. An RF power signal is generated from the RF power source to the chamber without igniting any plasma within the chamber. The voltage of the RF power signal, the current of the RF power signal, and the phase of the RF power signal, received by the chamber is measured while holding other parameters affecting the chamber constant. A value representative of an impedance of the chamber is computed based on the voltage, the current, and the phase. The value is then compared with a reference value to determine any defects in the plasma processing system. The reference value is representative of the impedance of a defect-free chamber.
机译:一种方法测试具有腔室,RF功率源和匹配网络的等离子体处理系统。从RF功率源向腔室生成RF功率信号,而不点燃腔室内的任何等离子体。在保持影响腔室恒定的其他参数的同时,测量腔室接收的RF功率信号的电压,RF功率信号的电流和RF功率信号的相位。基于电压,电流和相位来计算表示腔室的阻抗的值。然后将该值与参考值进行比较,以确定等离子体处理系统中的任何缺陷。参考值代表无缺陷腔室的阻抗。

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