Pattern transferring method for imprint lithography, involves using stamp with similar coefficient of thermal expansion as that of substrate, and heating and cooling stamp and substrate at set temperature to transfer pattern

摘要

The method involves utilizing a stamp (4) having a similar coefficient of thermal expansion as that of a substrate (1) e.g. aluminum. The stamp and the substrate are heated to a temperature at which a moldable film (2) becomes soft before pressing the stamp against the film. The stamp and the substrate are cooled at a temperature at which the film becomes hard, and the stamp is removed from the substrate. An independent claim is also included for a stamp for transferring a pattern provided on stamp to a substrate.