POLYIMIDE RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE

摘要

The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): CHEM wherein X represents -(CH2)k-, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.