ELECTRONIC PART STEP-PROCESSING APPARATUS, STEP-PROCESSING METHOD, AND STEP-PROCESSING PROGRAM

摘要

A high-reliability technique of step-processing an electronic part, capable of improving the productivity by shortening the carrying cycle, requiring few additional mechanisms, leading to low cost, and ensuring a long step-processing time. An electronic part step-processing apparatus comprises a carrying unit (1) having chuck nozzles (10) each capable of holding a semiconductor device (S) and intermittently moved to carry the semiconductor device (S), and a processing unit (2) having processing mechanisms (21, 22) for step-processing the semiconductor device (S). The chuck nozzles (10) include first nozzles (A1, B1,...) and second nozzles (A2, B2,...) for delivering a semiconductor device (S) to one of the processing mechanisms (21, 22) or receiving the semiconductor device (S) from the other of the processing mechanisms (21, 22) at a temporary stop. The apparatus further comprises transfer mechanisms (31, 32) for transferring the semiconductor device (S) between one of the first nozzles (A1, B1,...) and one of the second nozzles (A2, B2,...) upstream and downstream from the processing unit (2).