Laser processing device with layer by layer removal with die depth storage for future control

摘要

According to a method for measuring depth, the depths of measuring points are measured on a calibration plate. Correction data are used and stored for subsequent correction according to differences between the measured values and known values. According to a method for producing a die layer by layer, the horizontal limits (xg, yg) for removal within a layer (Si+1) are determined in accordance with the depth of the die (z), using the form definition of the die. The measured values can be continually stored and subsequently be used for controlling the laser-processing device.