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Solid-state laser processing apparatus and laser welding process with a laser beam diameter controller having an aperture

机译:固态激光加工设备和具有具有孔径的激光束直径控制器的激光焊接工艺

摘要

A solid-state laser processing apparatus includes a solid-state laser oscillator (2), a laser beam diameter controller (5), an optical fiber (11), and a processing head (12). The solid-state laser oscillator (2) oscillates a laser beam. The laser beam diameter controller (5) controls a beam diameter of the laser beam, and includes an aperture (5). The aperture (5) controls a beam quality of the laser beam defined by M2 so as to fall in a range of 85 ≦ M2 ≦ 105. The optical fiber (11) guides the controlled laser beam therein. The processing head (12) includes a transfer optical system (13), and irradiates the guided laser beam to a surface of a workpiece (15) to be processed by way of the transfer optical system (13).
机译:固态激光加工装置包括固态激光振荡器(2),激光束直径控制器(5),光纤(11)和加工头(12)。固态激光振荡器(2)振荡激光束。激光束直径控制器(5)控制激光束的束直径,并包括孔(5)。孔(5)控制由M2限定的激光束的光束质量,以使其落在85≤M2≤105的范围内。光纤(11)在其中引导受控激光束。加工头(12)包括转移光学系统(13),并且通过转移光学系统(13)将被引导的激光束照射到待加工的工件(15)的表面上。

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